IBM System/390 air-cooled alumina thermal conduction module
IBM Journal of Research and Development
Equipment-related advances in the fabrication of glass-ceramic/copper/polymide substrates
IBM Journal of Research and Development
Wet-process surface modification of dielectric polymers: adhesion enhancement and metallization
IBM Journal of Research and Development
An advanced multichip module (MCM) for high-performance UNIX servers
IBM Journal of Research and Development
IBM Journal of Research and Development - POWER5 and packaging
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