Reliability Implications of Bias-Temperature Instability in Digital ICs

  • Authors:
  • Sang Phill Park;Kunhyuk Kang;Kaushik Roy

  • Affiliations:
  • Purdue University;Intel;Purdue University

  • Venue:
  • IEEE Design & Test
  • Year:
  • 2009

Quantified Score

Hi-index 0.00

Visualization

Abstract

Editor's note:Bias temperature instability (BTI) is one of the major reliability challenges in nanoscale CMOS technology. This article investigates the severity of such degradation in logic and memory circuits. The simulation results reveal that BTI poses severe constraints on reliable memory design, especially in the presence of random process variations.—Yu Cao, Arizona State University