Layout effects in fine grain 3D integrated regular microprocessor blocks
Proceedings of the 48th Design Automation Conference
3D-MMC: a modular 3D multi-core architecture with efficient resource pooling
Proceedings of the Conference on Design, Automation and Test in Europe
DRAM selection and configuration for real-time mobile systems
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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Editors' NoteWe live in a 3D world. It is hard to imagine a large city, such as New York City, with only single-level structures. There would be no skyscrapers, no mixed-use, no live-work. It would be a long walk (or drive) between everything, especially between dissimilar uses—all in all, very inefficient!Integrated circuits today are typically designed using single-level Manhattan geometries, nothing like the layout of the real city. In this prolegomenon, Gabriel Loh and Yuan Xie survey 3D integrated circuit technology, demonstrating the virtues, potentials, and challenges of applying three dimensions to future microprocessor designs and exploiting the locality and diversity of real-world Manhattan geometries.