Creating 3D specific systems: architecture, design and CAD

Authors:
Paul D. Franzon;W. Rhett Davis;Thor Thorolffson
Affiliations:
North Carolina State University, Raleigh, NC;North Carolina State University, Raleigh, NC;North Carolina State University, Raleigh, NC
Venue:
Proceedings of the Conference on Design, Automation and Test in Europe
Year:
2010

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Abstract

3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.