Hierarchical Interconnection Networks for Multicomputer Systems
IEEE Transactions on Computers
Design and analysis of efficient hierarchical interconnection networks
Proceedings of the 1991 ACM/IEEE conference on Supercomputing
The block shift network: interconnection strategies for large parallel systems
The block shift network: interconnection strategies for large parallel systems
IEEE Transactions on Parallel and Distributed Systems
IEEE Transactions on Parallel and Distributed Systems
Folded Petersen Cube Networks: New Competitors for the Hypercubes
IEEE Transactions on Parallel and Distributed Systems
Extended Hypercube: A Hierarchical Interconnection Network of Hypercubes
IEEE Transactions on Parallel and Distributed Systems
The Hierarchical Hypercube: A New Interconnection Topology for Massively Parallel Systems
IEEE Transactions on Parallel and Distributed Systems
Fault-tolerant cycle embedding in the hypercube
Parallel Computing
THIN: a new hierarchical interconnection network-on-chip for SOC
ICA3PP'07 Proceedings of the 7th international conference on Algorithms and architectures for parallel processing
RTTM: a new hierarchical interconnection network for massively parallel computing
HPCA'09 Proceedings of the Second international conference on High Performance Computing and Applications
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Hierarchical interconnection networks (HINs) provide a framework for designing networks with reduced link cost by taking advantage of the locality of communication that exists in parallel applications. HINs employ multiple levels. Lower-level networks provide local communication while higher-level networks facilitate remote communication. HINs provide fault tolerance in the presence of some faulty nodes and/or links. Existing HINs can be broadly classified into two classes. those that use nodes and/or links replication and those that use standby interface nodes. The first class includes Hierarchical Cubic Networks, Hierarchical Completely Connected Networks, and Triple-based Hierarchical Interconnection Networks. The second HINs class includes Modular Fault-Tolerant Hypercube Networks and Hierarchical Fault-Tolerant Interconnection Network. This paper presents a review and comparison of the topological properties of both classes of HINs. The topological properties considered are network degree, diameter, cost and packing density. The outcome of this study show among all HINs two networks that is, the Root-Folded Heawood (RFH) and the Flooded Heawood (FloH), belonging to the first HIN class provide the best network cost, defined as the product of network diameter and degree. The study also shows that HFCube (n, n) provide the best packing density, that is, the smallest chip area required for VLSI implementation.