Efficient distributed on-chip decoupling capacitors for nanoscale ICs

  • Authors:
  • Mikhail Popovich;Eby G. Friedman;Radu M. Secareanu;Olin L. Hartin

  • Affiliations:
  • QCT, Qualcomm Corporation, San Diego, CA;Department of Electrical and Computer Engineering, University of Rochester, Rochester, NY;Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ;Microwave and Mixed Signal Technologies Laboratory, Freescale Semiconductor, Tempe, AZ

  • Venue:
  • IEEE Transactions on Very Large Scale Integration (VLSI) Systems
  • Year:
  • 2008

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Abstract

A distributed on-chip decoupling capacitor network is proposed in this paper. A system of distributed on-chip decoupling capacitors is shown to provide an efficient solution for providing the required on-chip decoupling capacitance under existing technology constraints. In a system of distributed on-chip decoupling capacitors, each capacitor is sized based on the parasitic impedance of the power distribution grid. Various tradeoffs in a system of distributed on-chip decoupling capacitors are also discussed. Related simulation results for typical values of on-chip parasitic resistance are also presented. The worst case error is 0.003% as compared to SPICE.