PRO3D: programming for future 3D manycore architectures

Authors:
Christian Fabre;Iuliana Bacivarov;Eth Zürich;Ananda Basu;Martino Ruggiero;David Atienza;Éric Flamand
Affiliations:
CEA LETI, bâtiment CTL, Z. I. de mayencin, Gières, France;Computer Engineering and Networks Laboratory, Gloriastrasse, Zürich, Switzerland;Computer Engineering and Networks Laboratory, Gloriastrasse, Zürich, Switzerland;VERIMAG Centre Equation, Gières, France;University of Bologna, Viale Risorgimento, Bologna, Italy;EPFL, ESL, Lausanne, Switzerland;ST Microelectronics, Grenoble, France
Venue:
Proceedings of the 2012 Interconnection Network Architecture: On-Chip, Multi-Chip Workshop
Year:
2012

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Abstract

PRO3D tackles two 3D technologies and their consequences on stacked architectures and software stack: through silicon vias (TSV) and liquid cooling. 3D memory hierarchies and the thermal impact of software on the 3D stack are mainly explored. The PRO3D software development flow is based on a rigorous assembly of software components and monitors the thermal integrity of the 3D stack. PRO3D experiments are mainly targeted on P2012, an industrial embedded manycore platform.