Delay uncertainty in single- and multi-wall carbon nanotube interconnects

Authors:
Debaprasad Das;Hafizur Rahaman
Affiliations:
School of VLSI Technology, Bengal Engineering and Science University, India;School of VLSI Technology, Bengal Engineering and Science University, India
Venue:
VDAT'12 Proceedings of the 16th international conference on Progress in VLSI Design and Test
Year:
2012

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Abstract

Carbon nanotube (CNT) has become the promising candidate for replacing the traditional copper based interconnect systems in future VLSI technology nodes. This paper analyzes delay uncertainty due to crosstalk in the Single- and Multi-wall CNT bundle based interconnect systems. Results are compared with traditional copper based interconnect systems. It is shown that the average crosstalk induced delay is within 60.5% over normal interconnect delay for double MWCNT as compared to 76.6% for copper and 72-75.2% for SWCNT and MWCNT bundle based interconnects. The average delay uncertainty with respect to Cu interconnects for SWCNT bundle based interconnect is found to be 75.3% and 84.6% for densely and sparsely packed SWCNT bundles, respectively, whereas it is 84.3% for MWCNT bundle and 61.6% for double MWCNT based interconnects.