Performance analysis of carbon nanotube interconnects for VLSI applications
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
A global view of interconnects
Microelectronic Engineering
Proceedings of the 2007 international workshop on System level interconnect prediction
Distortion of pulsed signals in carbon nanotube interconnects
Microelectronics Journal
Exploring Carbon Nanotube Bundle Global Interconnects for Chip Multiprocessor Applications
VLSID '09 Proceedings of the 2009 22nd International Conference on VLSI Design
NANOARCH '08 Proceedings of the 2008 IEEE International Symposium on Nanoscale Architectures
Fundamentals of RF and Microwave Transistor Amplifiers
Fundamentals of RF and Microwave Transistor Amplifiers
Studies on the Application of Carbon Nanotube as Interconnects for Nanometric VLSI Circuits
ICETET '09 Proceedings of the 2009 Second International Conference on Emerging Trends in Engineering & Technology
Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes
IEEE Transactions on Nanotechnology
An RF circuit model for carbon nanotubes
IEEE Transactions on Nanotechnology
IEEE Transactions on Nanotechnology
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Single Wall Carbon NanoTube (SWCNT) bundles have been recognized as a high promising substitution for current unsuitable interconnects. SWCNT bundle is a good conductor that plays heat piping role, as well. Nevertheless, some issues still exist in electrical modeling of the bundles. In this paper, we have demystified SWCNT bundle inductive behavior, by deriving the analytical and accurate closed-form magnetic inductance model of bundles, for the first time. The new model is suitable for the working frequencies of up to at least 10 GHz. Subsequently, two more fast and still highly accurate models of "Approximate" and "Fast Approximate" are developed through the introduction of the novel discrete rectangle GMD concept. Simulations and inspection through these modeling steps, show that the magnetic inductances of a bundle and of a Cu solid wire are almost equal and do not require new modeling. Finally, a notable fact will be underlined. That is in today's and near-future's working frequency and interconnect dimensions, the bundle interconnects will not exhibit inductive behavior, although both kinetic and magnetic inductance type effects are being considered.