EDA solutions to new-defect detection in advanced process technologies

  • Authors:
  • Erik Jan Marinissen;Gilbert Vandling;Sandeep Kumar Goel;Friedrich Hapke;Jason Rivers;Nikolaus Mittermaier;Swapnil Bahl

  • Affiliations:
  • IMEC, Leuven, Belgium;Cadence, Endicott, NY;TSMC, San Jose, CA;Mentor Graphics, Hamburg, Germany;AMD, Austin, TX;Synopsys, Dornach, Germany;ST Microelectronics, Agrate Brianza Italy

  • Venue:
  • DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
  • Year:
  • 2012

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Abstract

For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.