Efficient reduced-order modeling for the transient simulation of three-dimensional interconnect

Authors:
Mike Chou;Jacob White
Affiliations:
Department of EECS, Massachusetts Institute of Technology, Cambridge, MA;Department of EECS, Massachusetts Institute of Technology, Cambridge, MA
Venue:
ICCAD '95 Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design
Year:
1995

Citing 4
Cited 1

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Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures

DAC '95 Proceedings of the 32nd annual ACM/IEEE Design Automation Conference
Transient simulations of three-dimensional integrated circuit interconnect using a mixed surface-volume approach

DAC '95 Proceedings of the 32nd annual ACM/IEEE Design Automation Conference
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Abstract

Abstract: Multipole-accelerated surface-volume methods have proved to be very efficient techniques for delay and cross-talk simulation of three-dimensional integrated circuit interconnect. However, to be efficiently combined with transistor circuitry in a SPICE-level simulation, reduced-order models which have accurate low-frequency behavior must be constructed. Asymptotic Waveform Evaluation (AWE) or Pade-via-Lanczos (PVL) algorithms can not be used directly to construct the reduced-order models from the surface-volume formulation, because the formulation generates dense matrices which are too expensive to factor. In this paper we describe a two-level approach to efficiently generating reduced-order models with accurate low frequency behavior. First, reduced-order models which match Taylor series terms at s=/spl infin/ are efficiently generated from the surface-volume formulation using an Arnoldi method, and then these fairly high-order models are used to efficiently construct lower-order models which snatch Taylor series terms at s=0. Examples are given to demonstrate the accuracy of the resultant low-order model.