Predictive dynamic thermal management for multimedia applications
ICS '03 Proceedings of the 17th annual international conference on Supercomputing
Dynamic Thermal Management for High-Performance Microprocessors
HPCA '01 Proceedings of the 7th International Symposium on High-Performance Computer Architecture
Performance optimal processor throttling under thermal constraints
CASES '07 Proceedings of the 2007 international conference on Compilers, architecture, and synthesis for embedded systems
Proactive temperature balancing for low cost thermal management in MPSoCs
Proceedings of the 2008 IEEE/ACM International Conference on Computer-Aided Design
Dynamic thermal management for multimedia applications using machine learning
Proceedings of the 48th Design Automation Conference
Temperature and supply Voltage aware performance and power modeling at microarchitecture level
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Adaptive thermal management for portable system batteries by forced convection cooling
Proceedings of the Conference on Design, Automation and Test in Europe
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The thermal management is a crucial design problem for mobile devices because it greatly affects not only the device reliability, but also the leakage energy consumption. Conventional dynamic thermal management (DTM) techniques work well for the computer systems. However, due to the limitation of the physical space in mobile devices, the thermal coupling effect between the major heat generation components, such as the application processor (AP) and the battery, plays an important role in determining the temperature inside the mobile device package. Due to this effect, the thermal behavior of one part is no longer independent of the other, but is affected by the temperature of other parts. This is the first work that quantitatively characterizes the thermal coupling between the battery and AP and presents a predictive DTM for mobile devices considering this effect. Simulation results show that the proposed DTM method significantly reduces the thermal violations for the target mobile devices.