A built-in-test circuit for RF differential low noise amplifiers
IEEE Transactions on Circuits and Systems Part I: Regular Papers
Journal of Electronic Testing: Theory and Applications
RF Front-End Test Using Built-in Sensors
IEEE Design & Test
Structural RFIC device testing through built-in thermal monitoring
IEEE Communications Magazine
DC temperature measurements for power gain monitoring in RF power amplifiers
ITC '12 Proceedings of the 2012 IEEE International Test Conference (ITC)
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A differential temperature sensor for on-chip signal and DC power monitoring is presented for built-in testing and calibration applications. The amplifiers in the sensor are designed with class AB output stages to extend the dynamic range of the temperature/power measurements. Two high-gain amplification stages are used to achieve high sensitivity to temperature differences at points close to devices under test. Designed in 0.18 μm CMOS technology, the sensor has a simulated sensitivity that is tunable up to 210 mV/°C with a corresponding dynamic range of 13 °C. The sensor consumes 2.23 mW from a 1.8 V supply. A low-power version of the sensor was designed that consumes 1.125 mW from a 1.8 V supply, which has a peak sensitivity of 185.7 mV/°C over a 8 °C dynamic range.