Correlation analysis of particle clusters on integrated circuit wafers
IBM Journal of Research and Development
Exploiting Defect Clustering to Screen Bare Die for Infant Mortality Failures: An Experimental Study
ITC '99 Proceedings of the 1999 IEEE International Test Conference
IC Outlier Identification Using Multiple Test Metrics
IEEE Design & Test
| Hi-index | 14.98 |
We recently proposed a wafer-based testing approach which for the first time employs defect clustering information on the wafer to optimize test cost and defect levels in the shipped product. Preliminary analysis of this approach had implicitly assumed that the probability that a test detects a faulty circuit is independent of the number of faults in that circuit. This assumption may be optimistic. In this correspondence, we study the effect of clustering and test transparency on defect distributions in individual dice, and its impact on the fault detection capabilities of a given test set. We show here that significant defect-level improvements in the shipped product can indeed be achieved by exploiting defect clustering in optimization testing.