Correlation analysis of particle clusters on integrated circuit wafers
IBM Journal of Research and Development
On the Effect of Defect Clustering on Test Transparency and IC Test Optimization
IEEE Transactions on Computers
Binning for IC Quality: Experimental Studies on the SEMATECH Data
DFT '98 Proceedings of the 13th International Symposium on Defect and Fault-Tolerance in VLSI Systems
On Optimizing Wafer-Probe Testing for Product Quality Using Die-Yield Prediction
Proceedings of the IEEE International Test Conference on Test: Faster, Better, Sooner
Screening for Known Good Die (KGD) Based on Defect Clustering: An Experimental Study
Proceedings of the IEEE International Test Conference
VTS '97 Proceedings of the 15th IEEE VLSI Test Symposium
Defect Level as a Function of Fault Coverage
IEEE Transactions on Computers
IC quality and test transparency
ITC'88 Proceedings of the 1988 international conference on Test: new frontiers in testing
Estimating Burn-In Fall-Out for Redundant Memory
ITC '01 Proceedings of the 2001 IEEE International Test Conference
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We present the first experimental results toestablish that a binning strategy based ondefect clustering can be used to screen baredie for early life failures. The data for thisstudy comes from the SEMATECH1test methods experiment.