Correlation analysis of particle clusters on integrated circuit wafers
IBM Journal of Research and Development
Binning for IC Quality: Experimental Studies on the SEMATECH Data
DFT '98 Proceedings of the 13th International Symposium on Defect and Fault-Tolerance in VLSI Systems
Yield-Reliability Modeling for Fault Tolerant Integrated Circuits
DFT '01 Proceedings of the 16th IEEE International Symposium on Defect and Fault-Tolerance in VLSI Systems
Screening for Known Good Die (KGD) Based on Defect Clustering: An Experimental Study
Proceedings of the IEEE International Test Conference
Burn-In Failures and Local Region Yield: An Integrated Yield-Reliability Model
VTS '01 Proceedings of the 19th IEEE VLSI Test Symposium
Exploiting Defect Clustering to Screen Bare Die for Infant Mortality Failures: An Experimental Study
ITC '99 Proceedings of the 1999 IEEE International Test Conference
IBM Journal of Research and Development
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Integrated circuits can exhibit significant early life orinfant mortality failures.Methods to estimate and/orreduce the number of such failures are therefore of greatinterest to industry.Applications employing multi-chipmodules (MCMs), where several die must be independentlyreliable, are particularly vulnerable to early lifefailures.Maximizing the reliability of each die is thereforeof significant importance.This paper presents anintegrated yield-reliability model that allows one to estimatethe number of burn-in failures for repairablememory chips, a common component in many MCMsBecause defects in integrated circuits tend to cluster,memory chips that have been repaired have a greaterchance of containing a latent defect than chips withno repairs.The result is a higher incidence of infantmortality failure among memory chips that have beenrepaired.