Semi-analytical techniques for substrate characterization in the design of mixed-signal ICs

Authors:
Edoardo Charbon;Ranjit Gharpurey;Alberto Sangiovanni-Vincentelli;Robert S. Meyer
Affiliations:
Cadence Design Systems Inc., San Jose, CA;Texas Instruments Inc., Dallas, TX;Department of EECS, University of California, Berkeley, CA;Department of EECS, University of California, Berkeley, CA
Venue:
Proceedings of the 1996 IEEE/ACM international conference on Computer-aided design
Year:
1997

Citing 2
Cited 3

Constraint generation for routing analog circuits

DAC '90 Proceedings of the 27th ACM/IEEE Design Automation Conference
Mixed-signal switching noise analysis using Voronoi-tessellated substrate macromodels

DAC '95 Proceedings of the 32nd annual ACM/IEEE Design Automation Conference

Multilevel integral equation methods for the extraction of substrate coupling parameters in mixed-signal IC's

DAC '98 Proceedings of the 35th annual Design Automation Conference
Layout tools for analog ICs and mixed-signal SoCs: a survey

ISPD '00 Proceedings of the 2000 international symposium on Physical design
On the interaction of power distribution network with substrate

ISLPED '01 Proceedings of the 2001 international symposium on Low power electronics and design

Quantified Score

Hi-index	0.00

Visualization

Abstract

A number of methods are presented for highly efficient calculation of substrate current transport. A three-dimensional Green Function based substrate representation, in combination with the use of the Fast Fourier Transform, significantly speeds up the computation of sensitivities with respect to all parameters associated with a given architecture. Substrate sensitivity analysis is used in a number of physical optimization tools, such as placement and trend analysis for the estimation of the impact of technology migration and/or layout re-design.