Modeling and forecasting of manufacturing variations (embedded tutorial)
Proceedings of the 2001 Asia and South Pacific Design Automation Conference
A Fast Algorithm for the Layout Based Electro-Thermal Simulation
DATE '03 Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
METS: A Metric for Electro-Thermal Sensitivity, and Its Application To FinFETs
ISQED '06 Proceedings of the 7th International Symposium on Quality Electronic Design
Three-dimensional Integrated Circuit Design
Three-dimensional Integrated Circuit Design
Electro-thermal analysis of multi-fin devices
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Solution of PDEs-electrically coupled systems with electrical analogy
Integration, the VLSI Journal
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Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried out by using the industry-standard simulator SABER, therefore for electro-thermal simulations we are able to use the common electrical compact models by adding a heat source and thermal pins to them. The application of this technique and need for electro-thermal simulation is illustrated with the simulation of a current control circuit built into a multiwatt package.