Vertical pitch limitations on performance enhancement in bonded three-dimensional interconnect architectures

Authors:
James W. Joyner;Payman Zarkesh-Ha;Jeffrey A. Davis;James D. Meindl
Affiliations:
Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA
Venue:
SLIP '00 Proceedings of the 2000 international workshop on System-level interconnect prediction
Year:
2000

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Abstract