Efficient techniques for accurate modeling and simulation of substrate coupling in mixed-signal IC's

Authors:
J.-P. Costa;M. Chou;L. M. Silveira
Affiliations:
INESC/Cadence European Laboratories, Dept. of Electrical and Computer Engineering, Instituto Superior Técnico, Lisboa, 1000 Portugal;Research Laboratory of Electronics, Dept. of Electrical Eng. and Computer Science, Massachusetts Institute of Technology, Cambridge, MA;INESC/Cadence European Laboratories, Dept. of Electrical and Computer Engineering, Instituto Superior Técnico, Lisboa, 1000 Portugal
Venue:
Proceedings of the conference on Design, automation and test in Europe
Year:
1998

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Abstract

Industry trends aimed at integrating higher levels of circuit functionality have triggered a proliferation of mixed analog-digital systems. Magnified noise coupling through the common chip substrate has made the design and verification of such systems an increasingly difficult task. In this paper we present a fast eigendecomposition technique that accelerates operator application in BEM methods and avoids the dense-matrix storage while taking all of the substrate boundary effects into account explicitly. This technique can be used for accurate and efficient modeling of substrate coupling effects in mixed-signal integrated circuits.