Computer Architecture and Parallel Processing
Computer Architecture and Parallel Processing
The computational speed of supercomputers
SIGMETRICS '83 Proceedings of the 1983 ACM SIGMETRICS conference on Measurement and modeling of computer systems
Analysis of Cray-1S architecture
ISCA '83 Proceedings of the 10th annual international symposium on Computer architecture
Parallel processing architecture for the Hitachi S-3800 shared-memory vector multiprocessor
ICS '93 Proceedings of the 7th international conference on Supercomputing
The Social Limits of Speed: The Development and Use of Supercomputers
IEEE Annals of the History of Computing
Distributed storage control unit for the Hitachi S-3800 multivector supercomputer
ICS '94 Proceedings of the 8th international conference on Supercomputing
Instruction Level Distributed Processing
HiPC '00 Proceedings of the 7th International Conference on High Performance Computing
A New Loop Partition Method-Clustering
PACT '93 Proceedings of the IFIP WG10.3. Working Conference on Architectures and Compilation Techniques for Fine and Medium Grain Parallelism
The Reconfigurable Streaming Vector Processor (RSVPTM)
Proceedings of the 36th annual IEEE/ACM International Symposium on Microarchitecture
The design space of data-parallel memory systems
Proceedings of the 2006 ACM/IEEE conference on Supercomputing
Efficient vectorization of SIMD programs with non-aligned and irregular data access hardware
CASES '08 Proceedings of the 2008 international conference on Compilers, architectures and synthesis for embedded systems
| Hi-index | 4.12 |
The authors' experience in designing and manufacturing the Cray X-MP supercomputer is described. The X-MP is a multiprocessor design built on the basic architecture of the Cray-1 and incorporates the 16-gate emitter-coupled logic gate arrays used in the Cray-2 project. The goal was a two-processor machine compatible with the Cray-1 but with performance 1.5 to 2 times better. The authors examine the architectural considerations. They discuss the use of electronic design rules and CAD (computer-aided design); the packaging, interconnections, and cooling; and assembly and testing