Automatic Detection of Spatial Signature on Wafermaps in a High Volume Production

Authors:
Frederic Duvivier
Affiliations:
-
Venue:
DFT '99 Proceedings of the 14th International Symposium on Defect and Fault-Tolerance in VLSI Systems
Year:
1999

Citing 0
Cited 2

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Expert Systems with Applications: An International Journal

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Abstract

In high volume production, it is important to have a fast response time to yield loss mechanisms. This paper presents a way to detect spatial yield loss on wafers. A procedure automatically computes and provides a summary of signatures taking into account all processed wafers. This reduces manual manipulation of the data, providing a faster response time.