Prediction of wiring space requirements for LSI
DAC '77 Proceedings of the 14th Design Automation Conference
A logic design structure for LSI testability
DAC '77 Proceedings of the 14th Design Automation Conference
Basic concepts of timing-oriented design automation for high-performance mainframe computers
DAC '91 Proceedings of the 28th ACM/IEEE Design Automation Conference
Diagnosis of TCM failures in the IBM 3081 Processor complex
DAC '83 Proceedings of the 20th Design Automation Conference
Operational aspects of design automation for the IBM 3081
DAC '82 Proceedings of the 19th Design Automation Conference
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The development of the IBM 3081 established the methodology for designing and manufacturing a high-performance computer from an LSI chip technology. The high density packaging of the LSI chip is used to minimize interconnections and to support a fast machine cycle time. This paper will describe the methods used and will highlight some of the design problems that were solved, to offer an understanding of the challenges that LSI brings to the design cycle.