Validated 90nm CMOS Technology Platform with Low-k Copper Interconnects for Advanced System-on-Chip (SoC)

  • Authors:
  • T. Devoivre;M. Lunenborg;C. Julien;J.-P. Carrere;P. Ferreira;W. J. Toren;A. VandeGoor;P. Gayet;T. Berger;O. Hinsinger;P. Vannier;Y. Trouiller;Y. Rody;P.-J. Goirand;R. Palla;I. Thomas;F. Guyader;D. Roy;B. Borot;N. Planes;S. Naudet;F. Pico;D. Duca;F. Lalanne;D. Heslinga;M. Haond

  • Affiliations:
  • -;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-;-

  • Venue:
  • MTDT '02 Proceedings of the The 2002 IEEE International Workshop on Memory Technology, Design and Testing
  • Year:
  • 2002

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Abstract

This paper presents a complete 90nm CMOS technology platform dedicated to advanced SoC manufacturing, featuring 16 Å EOT-70nm transistors (standard process) or 21 -90nm transistors (Low Power process) as well as 2.5 or 3.3V I/O transistors, copper interconnects and SiOC low-k IMD (k=2.9). The main critical process steps are described and electrical results are discussed. Moreover, using advanced lithographic tools, fully functional 1Mbit SRAM instances, based on a highly manufacturable 6T 1.36µm虏 memory cell, have beenprocessed. The cell is detailed and its features, both electrical and morphological, are discussed.