On-Chip Communication Architectures: System on Chip Interconnect
On-Chip Communication Architectures: System on Chip Interconnect
A data capturing method for buses on chip
IEEE Transactions on Circuits and Systems Part I: Regular Papers
Performance Analysis of On-Chip Communication Structures under Device Variability
International Journal of Embedded and Real-Time Communication Systems
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Signalling over long interconnect is a dominant issue in electronic chip design in current technologies, with the device sizes getting smaller and smaller and the circuits becoming ever larger. Repeater insertion is a well established technique to minimise the propagation delay over long resistive interconnect. In deep sub-micron technologies, as the wires are spaced closer and closer together and signal rise and fall times go into the sub-nano second region, the coupling between interconnects assumes great significance. The resulting cross talk has implications on the data throughput and on signal integrity. Depending on the data correlation on the coupled lines, the delay can either decrease or increase. In this paper we attempt to quantify the effect of worst-case capacitive cross talk in parallel buses and look at how it affects repeater insertion in particular. We develop analytic expressions for the delay, buffer size and number that are suitable in a-priori timing analyses and signal integrity estimations. All equations are checked against a dynamic circuit simulator (SPECTRE).