From System Specification To Layout: Seamless Top-Down Design Methods for Analog and Mixed-Signal Applications

  • Authors:
  • R. Sommer;I. Rugen-Herzig;E. Hennig;U. Gatti;P. Malcovati;F. Maloberti;K. Einwich;C. Clauss;P. Schwarz;G. Noessing

  • Affiliations:
  • Infineon Technologies AG - Germany;Infineon Technologies AG - Germany;Infineon Technologies AG - Germany;Siemens ICN - Italy;University of Pavia - Italy;University of Pavia - Italy;FhG IIS - Germany;FhG IIS - Germany;FhG IIS - Germany;Infineon Technologies AG - Austria

  • Venue:
  • Proceedings of the conference on Design, automation and test in Europe
  • Year:
  • 2002

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Abstract

Deisgn automation for analog/mixed-signal (A/MS) circuits and systems is still lagging behind compared to what has been reached in the digital area.As System-on-Chip (SoC) designs include analog components in more cases, these analog parts become even more a bottle neck in the overall design process.The paper is dedicated to latest R&D activities within the MEDEA+ project ANASTASIA+.Main focus will be the development of seamless top-down design methods for integrated analog and misx-signal systems and to achieve a high level of automation and reuse in the A/MS design process.These efforts are motivated by the urgent need to close the current gap in the industrial design flow between system specification and design on the one hand and block-level circuit design on the other hand.The paper will focus on the three subtopics starting with the top-down design flow with applications from circuits sizing, design centering, and automated behaviorial modeling.The next part focuses on modeling and simulation of specific functionalities in sigma-delta design while the last section is dedicated to a mixed-signal System-on-Chip design environment.