Interconnect coupling noise in CMOS VLSI circuits
ISPD '99 Proceedings of the 1999 international symposium on Physical design
An efficient analytical model of coupled on-chip RLC interconnects
Proceedings of the 2001 Asia and South Pacific Design Automation Conference
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In this paper, we present a new RLC crosstalk noise model that combines simplicity, accuracy, and generality. The new model is based on transmission line theory and is applicable to asymmetric driver and line configurations. The results show that the model captures both the waveform shape and peak noise accurately (average error in peak noise was 6.5%). A key feature of the new model is that its derivation and form enables physical insight into the dependency of total coupling noise on relevant physical design parameters. The model is applied to investigate the impact of various physical design optimizations (e.g., wire sizing and spacing, shield insertion) on total RLC coupled noise. Results indicate that common (capacitive) noise avoidance techniques can behave quite differently when both capacitive and inductive coupling are considered together.