Dynamic tuning of chemical-mechanical planarization operation via sliding-mode theory

Authors:
Chia-Shui Lin;Chien-Yu Chi
Affiliations:
Department of Mechanical Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu 30050, Taiwan;Department of Mechanical Engineering, National Chiao Tung University, 1001 Ta Hsueh Road, Hsin-Chu 30050, Taiwan
Venue:
Microelectronic Engineering
Year:
2004

Citing 3
Cited 1

Dependency of dishing on polish time and slurry chemistry in Cu CMP

Proceedings of the third Europeon workshop on Materials for advanced metallization
Robust operation of copper chemical mechanical polishing

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Application of soft landing to the process control of chemical mechanical polishing

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Chemical mechanical planarization operation via dynamic programming

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Abstract

The development of chemical-mechanical planarization (CMP) to date relies on multi-stage polishing for better performance. The straight relationship between performance and operation provides a new method of control for CMP process. The strategy of dynamic tuning is proposed in this paper and one possible operation profile is established via sliding-mode theory. Because of the lack of operation mechanism of the equipment in existence, more elaborate experimental verification of the strategy is yet to follow. We may need to work with some equipment suppliers. Based on the proposed strategy, lower dishing and more efficient copper step height reduction can be verified from some numerical simulations. Simulation results show better performance under the same throughput.