Cycle-accurate simulation of energy consumption in embedded systems
Proceedings of the 36th annual ACM/IEEE Design Automation Conference
Towards a new standard for system-level design
CODES '00 Proceedings of the eighth international workshop on Hardware/software codesign
Short-Range Wireless Communication: Fundamentals of RF System Design and Application with Cdrom
Short-Range Wireless Communication: Fundamentals of RF System Design and Application with Cdrom
Power Aware Design Methodologies
Power Aware Design Methodologies
Battery-Driven System Design: A New Frontier in Low Power Design
ASP-DAC '02 Proceedings of the 2002 Asia and South Pacific Design Automation Conference
Energy-efficient communication for high density networks
Ambient intelligence
Layer assignment for reliable system-on-package
Proceedings of the 2004 Asia and South Pacific Design Automation Conference
IC Design Challenges for Ambient Intelligence
DATE '03 Proceedings of the conference on Design, Automation and Test in Europe - Volume 1
Energy Scavenging for Mobile and Wireless Electronics
IEEE Pervasive Computing
The development of a novel minaturized modular platform for wireless sensor networks
IPSN '05 Proceedings of the 4th international symposium on Information processing in sensor networks
Proceedings of the 5th international conference on Embedded networked sensor systems
1-cc computer using UWB-IR for wireless sensor network
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
SENESCOPE: A design tool for cost optimization of wireless sensor nodes
IPSN '09 Proceedings of the 2009 International Conference on Information Processing in Sensor Networks
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Miniaturized wireless sensors are mostly easier to integrate into everyday objects and show very high mechanical robustness. The development of these embedded micro systems has to consider the interdependence of design decisions regarding network communication, wireless sensor hardware and fabrication technology. An event driven simulator in combination with a 3D placement tool was used to predict the total system volume. The potential miniaturization degree is derived according to different 3D packaging technologies. The results are verified by prototype implementations.