Digital systems engineering
High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices
High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices
High-speed signal propagation: advanced black magic
High-speed signal propagation: advanced black magic
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Editor's note: System-in-package provides highly integrated packaging with high-speed performance. Many SiP packages contain low-cost 3D stacked chips interconnected by fine wire bonds. In a high-frequency spectrum, these wire bonds can cause discontinuities causing signal degradation. This article addresses problems with wire-bonding in high-frequency SiP packages and proposes design methodologies to reduce these discontinuities.