Mobile system considerations for SDRAM interface trends
Proceedings of the System Level Interconnect Prediction Workshop
System-in-Package: Electrical and Layout Perspectives
Foundations and Trends in Electronic Design Automation
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With increasing aggregate off-chip bandwidths exceeding terabits/second (Tb/s), the power dissipation is a serious design consideration. Additionally, design of I/O links is constrained by a complex set of specifications such as voltage levels, voltage noise, signal deterministic jitter, random jitter, slew rate, BER etc. These specifications lead to complex tradeoffs for both circuits and circuit architecture in order to minimize power. This paper presents a design framework that enables the analysis of tradeoffs in the design of an I/O transmitter. The design framework includes BER analysis with a channel model coupled with logic sizing optimization that is constrained by the desired signaling specification.