A study of thread migration in temperature-constrained multicores
ACM Transactions on Architecture and Code Optimization (TACO)
Modeling of data center airflow and heat transfer: State of the art and future trends
Distributed and Parallel Databases
Comparison of transient and static test methods for chip-to-sink thermal interface characterization
Microelectronics Journal
Thermodynamics of information technology data centers
IBM Journal of Research and Development
CFD-based operational thermal efficiency improvement of a production data center
SustainIT'10 Proceedings of the First USENIX conference on Sustainable information technology
Proceedings of the 38th annual international symposium on Computer architecture
Semi-automated data center hotspot diagnosis
Proceedings of the 7th International Conference on Network and Services Management
Proactive thermal management in green datacenters
The Journal of Supercomputing
Towards a net-zero data center
ACM Journal on Emerging Technologies in Computing Systems (JETC)
Energy-Efficient Thermal-Aware Autonomic Management of Virtualized HPC Cloud Infrastructure
Journal of Grid Computing
Overview of IBM zEnterprise 196 I/O subsystem with focus on new PCI express infrastructure
IBM Journal of Research and Development
CoMETC: Coordinated management of energy/thermal/cooling in servers
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Review: A survey on architectures and energy efficiency in Data Center Networks
Computer Communications
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The need for more performance from computer equipment in data centers has driven the power consumed to levels that are straining thermal management in the centers. When the computer industry switched from bipolar to CMOS transistors in the early 1990s, low-power CMOS technology was expected to resolve all problems associated with power and heat. However, equipment power consumption with CMOS has been rising at a rapid rate during the past 10 years and has surpassed power consumption from equipment installed with the bipolar technologies 10 to 15 years ago. Data centers are being designed with 15-20-year life spans, and customers must know how to plan for the power and cooling within these data centers. This paper provides an overview of some of the ongoing work to operate within the thermal environment of a data center. Some of the factors that affect the environmental conditions of data-communication (datacom) equipment within a data center are described. Since high-density racks clustered within a data center are of most concern, measurements are presented along with the conditions necessary to meet the datacom equipment environmental requirements. A number of numerical modeling experiments have been performed in order to describe the governing thermo-fluid mechanisms, and an attempt is made to quantify these processes through performance metrics.