A golden-template self-generating method for patterned wafer inspection
Machine Vision and Applications
Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates
Microelectronic Engineering
Wavelet-based principal component analysis applied to automated surface defect detection
ACC'08 Proceedings of the WSEAS International Conference on Applied Computing Conference
Computer-Aided Vision System for Surface Blemish Detection of LED Chips
ICANNGA '07 Proceedings of the 8th international conference on Adaptive and Natural Computing Algorithms, Part II
A Wavelet-Based Neural Network Applied to Surface Defect Detection of LED Chips
ISNN '07 Proceedings of the 4th international symposium on Neural Networks: Part II--Advances in Neural Networks
Expert Systems with Applications: An International Journal
WSEAS Transactions on Computer Research
An enhanced memetic differential evolution in filter design for defect detection in paper production
Evolutionary Computation
Defect detection in patterned wafers using anisotropic kernels
Machine Vision and Applications
Wavelet-based defect detection in solar wafer images with inhomogeneous texture
Pattern Recognition
Hi-index | 2.89 |
A template-based vision system for the 100% inspection of wafer die surfaces has been developed. Design goals included a requirement for the detection of flaws as small as two thousandths of an inch on parts up to 8-in. wafer size. Each die is treated as one part of the whole wafer. One of the good dies is trained and kept as template die for the whole wafer. The die physical location data are generated, beforehand, from the wafer map supplied by the wafer manufacturers. A separate software package called the wafer map editor (WME) was developed to generate setup data needed during the runtime of the inspection process. The WME generates an updated wafermap with in-house defects after inspection of the wafer surface. Each unique die pattern in the wafer is defined as an object and these objects are grouped into user-defined categories, such as good die pads and defect die pads. The defect wafer map is used during the runtime inspection of die attach to avoid picking of bad dies.