Temperature-aware circuit design using adaptive body biasing

Authors:
Yan Zhang;Mircea Stan
Affiliations:
Qualcomm, San Diego, CA;University of Virginia, Charlottesville, VA
Venue:
Proceedings of the 17th ACM Great Lakes symposium on VLSI
Year:
2007

Citing 3
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Abstract

Due to continuously increasing active power dissipation die temperatures exhibit significant spatial and temporal variability. Targeting the worst-case temperature is not optimal as performance will be lost for non-worst cases. This paper proposes a temperature-adaptive body bias technique that can dynamically recover this lost performance. Two applications are described that demonstrate the effectiveness of proposed technique.