An MILP-based wire spreading algorithm for PSM-aware layout modification
Proceedings of the 2008 Asia and South Pacific Design Automation Conference
Proceedings of the 18th ACM Great Lakes symposium on VLSI
Post-routing redundant via insertion with wire spreading capability
Proceedings of the 2009 Asia and South Pacific Design Automation Conference
Redundant via insertion with wire bending
Proceedings of the 2009 international symposium on Physical design
Enhanced double via insertion using wire bending
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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In this paper, we describe the application of redundant via insertion (RV) to the restricted topologies proposed for gridded and alternating phase shift mask layouts. Adding redundant vias has been shown to improve the yield and reliability of designs. We show that it is possible to successfully add redundant vias, provided that the gridded layer is adjacent to a layer that can receive the additional layout complexity of the off-direction routing necessary to add additional vias. We compare a static method for via insertion that does not move existing wires with a dynamic method that shifts wires to make space for additional vias.