Post-silicon diagnosis of segments of failing speedpaths due to manufacturing variations
Proceedings of the 47th Design Automation Conference
Trace signal selection to enhance timing and logic visibility in post-silicon validation
Proceedings of the International Conference on Computer-Aided Design
Custom on-chip sensors for post-silicon failing path isolation in the presence of process variations
DATE '12 Proceedings of the Conference on Design, Automation and Test in Europe
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Fast time to market and high performance translate to improved profit margins in the microprocessor business. The microprocessor design flow first involves design and timing convergence, then several iterations of frequency pushes on silicon, and finally volume production and sale to the market. Inevitably, speed failures occur because of frequency pushes, and these are prioritized on the basis of severity. Practical aspects such as time-to-market requirements limit the magnitude of eventual frequency push based on the amount of failures that can be analyzed. The authors of this article have analyzed 56 speed failures to understand the underlying causes. Specifically, they have studied the effects of multiple-input switching, cross-coupling noise, and localized voltage droop. Understanding the causes of speed failures provides insight so that designers can develop design strategies for better power-performance tradeoffs.