Pad assignment for die-stacking System-in-Package design

Authors:
Yu-Chen Lin;Wai-Kei Mak;Chris Chu;Ting-Chi Wang
Affiliations:
National Tsing Hua University, Hsinchu, Taiwan;National Tsing Hua University, Hsinchu, Taiwan;Iowa State University, Ames, IA;National Tsing Hua University, Hsinchu, Taiwan
Venue:
Proceedings of the 2009 International Conference on Computer-Aided Design
Year:
2009

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Abstract

Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so as to facilitate wire bonding, is an important physical design problem for SiP design because the quality of a pad assignment solution affects both the cost and performance of a SiP design. In this paper, we study a pad assignment problem, which prohibits the generation of illegal crossings and aims to minimize the total signal wirelength, for die-stacking SiP design. We first consider a variety of special cases and present a minimum-cost maximum-flow based approach to optimally solve them in polynomial time. We then describe an approach, which uses a modified left edge algorithm and an integer linear programming technique, to solve the general case. Encouraging experimental results are shown to support our approaches.