A STAND-ALONE INTEGRATED TEST CORE FOR TIME AND FREQUENCY DOMAIN MEASUREMENTS
ITC '00 Proceedings of the 2000 IEEE International Test Conference
On-Chip Testing Techniques for RF Wireless Transceivers
IEEE Design & Test
Radio Frequency Integrated Circuits and Technologies
Radio Frequency Integrated Circuits and Technologies
A low-cost test solution for wireless phone RFICs
IEEE Communications Magazine
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The estimation of 1 dB compression and third-order intercept points can be obtained after the cross-correlation between dynamic current and output voltage of radio frequency power amplifiers. This estimation is performed using actual power measurements and not power inferred from voltage values. The underlining theory and a correlator that allows implementing this measurement on-chip are presented. The trade-off between measuring voltage and the actual power is also discussed and it is shown that different information concerning the output load is obtained when observing the PA's output voltage and power. Simulation results, obtained with the model of a prototype demonstration chip, show that good accuracy can be obtained with relatively simple measurement conditions. These results include the analysis of optimum stimuli amplitudes and the effect of noise in estimation accuracy.