A Simple and Unified Method for Drawing Graphs: Magnetic-Spring Algorithm
GD '94 Proceedings of the DIMACS International Workshop on Graph Drawing
A layout dependent full-chip copper electroplating topography model
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Wire density driven global routing for CMP variation and timing
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
Technology migration techniques for simplified layouts with restrictive design rules
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
CMP-aware Maze Routing Algorithm for Yield Enhancement
ISVLSI '07 Proceedings of the IEEE Computer Society Annual Symposium on VLSI
ASP-DAC '07 Proceedings of the 2007 Asia and South Pacific Design Automation Conference
Novel wire density driven full-chip routing for CMP variation control
Proceedings of the 2007 IEEE/ACM international conference on Computer-aided design
DFM Based Detailed Routing Algorithm for ECP and CMP
ISQED '08 Proceedings of the 9th international symposium on Quality Electronic Design
Track routing optimizing timing and yield
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Simultaneous OPC- and CMP-aware routing based on accurate closed-form modeling
Proceedings of the 2013 ACM international symposium on International symposium on physical design
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In this paper, a novel design-for-manufacture-aware detailed routing algorithm that seeks to minimize the thickness range of the chip surface after copper damascene process is proposed. The paper is based on an electroplating (ECP) and chemical mechanical polishing (CMP) model and predictors for final thickness range are abstracted. The proposed detailed routing is implemented in a W-shape multilevel full-chip routing framework using depth first search and branch-and-bound techniques in maze backtracking. Experimental results show that compared to maze routing (MR) (that does not consider CMP), the improvements in the average metal density standard and the average amount of dummy fill are 12.0% and 6.99% respectively. Compared to density-drivenmaze routing (DMR) that considers only CMP but does not consider ECP, the improvements in the average metal density standard and the average amount of dummy fill are 0.53% and 0.72%, respectively. So, the proposed algorithm can obtain improvement in optimizing CMP while the wire length and vias are not increased clearly and the completion rate is guaranteed. Therefore, the yield of chips is improved.