Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability
Proceedings of the 37th Annual Design Automation Conference
RADAR: RET-aware detailed routing using fast lithography simulations
Proceedings of the 42nd annual Design Automation Conference
Maze routing with OPC consideration
Proceedings of the 2005 Asia and South Pacific Design Automation Conference
SPIDER: simultaneous post-layout IR-drop and metal density enhancement with redundant fill
ICCAD '05 Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design
Wire density driven global routing for CMP variation and timing
Proceedings of the 2006 IEEE/ACM international conference on Computer-aided design
A novel wire-density-driven full-chip routing system for CMP variation control
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Predictive formulae for OPC with applications to lithography-friendly routing
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
ECP- and CMP-aware detailed routing algorithm for DFM
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Proceedings of the 48th Design Automation Conference
MR: a new framework for multilevel full-chip routing
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Multilevel Full-Chip Routing With Testability and Yield Enhancement
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
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As the process technology advances to the nanometer nodes, Optical Proximity Correction (OPC) is the most popular Resolution-Enhancement Technique (RET) in industry for subwavelength lithography, and the inter-level dielectric (ILD) thickness variation caused by the planarization step of the Chemical-Mechanical Polishing (CMP) process also plays a key role for interconnect yield. Considering the OPC and CMP effects simultaneously during the routing stage can significantly alleviate the width and thickness variations (and thus the whole 3D geometry variations) of post-layout RET and CMP operations. In this paper, we first present an efficient, yet sufficiently accurate closed-form formula for printed width computation and dummy-insertion-aware routing cost derivation. The formula provides a cost modeling for post-layout OPC and CMP optimization during routing. Incorporating the OPC and CMP costs, the router can be guided to optimize the effects of layout correction and planarization. Compared with the state-of-the-art OPC-friendly router, QL-MGR (which does not consider CMP), the experimental results show that our approach can achieve respective 19% and 6% reductions in the maximum and average layout distortions. Compared with the state-of-the-art CMP-aware router, TTR (which does not consider OPC), the experimental results show that our approach can achieve respective 19% and 25% reductions in the peak-to-peak thickness and thickness variance. These results indicate that our simultaneous OPC- and CMP-aware router contributes a significant improvement for layout integrity.