Packaging design challenges of the IBM system z10 enterprise class server

  • Authors:

  • T.-M. Winkel;H. Harrer;D. Kaller;J. Supper;D. M. Dreps;K. L. Christian;D. Cosmadelis;T. Zhou;T. Strach;J. Ludwig;D. L. Edwards

  • Affiliations:

  • IBM Entwicklung GmbH, Boeblingen, Germany;IBM Entwicklung GmbH, Boeblingen, Germany;IBM Entwicklung GmbH, Boeblingen, Germany;IBM Entwicklung GmbH, Boeblingen, Germany;IBM Systems and Technology Group, Austin, Texas;IBM Systems and Technology Group, Poughkeepsie, New York;IBM Systems and Technology Group, Hopewell Junction, New York;IBM Systems and Technology Group, Austin, Texas;IBM Entwicklung GmbH, Boeblingen, Germany;IBM Systems and Technology Group, Poughkeepsie, New York;IBM Systems and Technology Group, Poughkeepsie, New York

  • Venue:
  • IBM Journal of Research and Development
  • Year:
  • 2009

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Abstract

This paper describes the system packaging and technologies of the IBM System z10™ high-end Enterprise Class server. This machine exceeds the multiprocessor performance of the previous system by 50%. A new generation of the IBM Elastic Interface was developed in order to maintain the increased interconnect signal speed of up to 2.93 Gb/s. Power control and power delivery to the multicore processors were a special challenge for the server packaging because of the high currents and the high number of voltage domains.