Simultaneous multithreading: maximizing on-chip parallelism
ISCA '95 Proceedings of the 22nd annual international symposium on Computer architecture
Wattch: a framework for architectural-level power analysis and optimizations
Proceedings of the 27th annual international symposium on Computer architecture
Comparing power consumption of an SMT and a CMP DSP for mobile phone workloads
CASES '01 Proceedings of the 2001 international conference on Compilers, architecture, and synthesis for embedded systems
Computer
A survey of processors with explicit multithreading
ACM Computing Surveys (CSUR)
Area and System Clock Effects on SMT/CMP Processors
Proceedings of the 2001 International Conference on Parallel Architectures and Compilation Techniques
The energy efficiency of CMP vs. SMT for multimedia workloads
Proceedings of the 18th annual international conference on Supercomputing
Performance, Energy, and Thermal Considerations for SMT and CMP Architectures
HPCA '05 Proceedings of the 11th International Symposium on High-Performance Computer Architecture
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In embedded world, many researchers have begun to examine Simultaneous Multithreading (SMT) and Chip Multiprocessing (CMP) for various demands. SMT and CMP both make a chip to achieve greater throughput. But the power, chip size and thermal features are also important for embedded system. In this paper we compare the design space of both architecture. As simulation results shown, although extending wide-issue processor into SMT has the advantage of small design changes, high hardware resource efficiency and high throughput, CMP presents better scalability in raw performance and power metric under heavy multithreaded workload than SMP. CMP integrates several similar processor in a single chip, so it can’t uses the chip area efficiently like SMT. And the chip area limits will prevent the CMP from equipping a large L2 cache, which will hurt the performance of memory-bound application. The evaluation also points out the design problem and possible solution for power, chip size and thermal efficiency in CMP and SMT.