SOC test architecture optimization for signal integrity faults on core-external interconnects
Proceedings of the 44th annual Design Automation Conference
ACM Transactions on Design Automation of Electronic Systems (TODAES)
Built-in sensor for signal integrity faults in digital interconnect signals
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Hi-index | 0.03 |
Signal integrity closure is one of the key challenges in deep submicron physical design. In this paper, we propose a physical design methodology which includes signal integrity management through crosstalk noise analysis and repair at multiple phases of the design so that a quick noise convergence can be achieved. The methodology addresses both functional and delay noise problems in the design and is targeted for block-, platform-, and chip-level physical design of system-on-chip designs. A number of case studies are presented to illustrate the effectiveness of the proposed methodology and to provide valuable insights useful for successful signal integrity management.