SOC test architecture optimization for signal integrity faults on core-external interconnects

  • Authors:
  • Qiang Xu;Yubin Zhang;Krishnendu Chakrabarty

  • Affiliations:
  • The Chinese University of Hong Kong, Shatin, N.T., Hong Kong;The Chinese University of Hong Kong, Shatin, N.T., Hong Kong;Duke University, Durham, NC

  • Venue:
  • Proceedings of the 44th annual Design Automation Conference
  • Year:
  • 2007

Quantified Score

Hi-index 0.00

Visualization

Abstract

The test time for core-external interconnect shorts/opens is typically much less than that for core-internal logic. Therefore, prior work on test infrastructure design for core-based system-on-a-chip (SOC) has mainly focused on minimizing the test time for core-internal logic. However, as feature sizes shrink for newer process technologies, the test time for interconnect signal integrity (SI) faults cannot be neglected. We investigate the impact of interconnect SI tests on SOC test architecture design and optimization. We present a compaction method for SI faults and algorithms for test architecture optimization. Experimental results for the ITC'02 benchmarks show that the proposed approach can significantly reduce the overall testing time for core-internal logic and core-external interconnects.