Self-test methodology for at-speed test of crosstalk in chip interconnects

  • Authors:
  • Xiaoliang Bai;Sujit Dey;Janusz Rajski

  • Affiliations:
  • Department of ECE, University of California, San Diego;Department of ECE, University of California, San Diego;Mentor Graphics Corporation, Wilsonville, OR

  • Venue:
  • Proceedings of the 37th Annual Design Automation Conference
  • Year:
  • 2000

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Abstract

The effect of crosstalk errors is most significant in high-performance circuits, mandating at-speed testing for crosstalk defects. This paper describes a self-test methodology that we have developed to enable on-chip at-speed testing of crosstalk defects in System-on-Chip interconnects. The self-test methodology is based on the Maximal Aggressor Fault Model [13], that enables testing of the interconnect with a linear number of test patterns. To enable self-testing of the interconnects, we have designed efficient on-chip test generators and error detectors to be embedded in necessary cores; while the test generators generate test vectors for crosstalk faults, the error detectors analyze the transmission of the test sequences received from the interconnects, and detect any transmission errors. We have also designed test controllers to initiate and manage test transactions by activating the appropriate test generators and error detectors, and having error diagnosis capability. We have developed, simulated, and synthesized parameterized HDL models of the self-test structures. We have applied the self-test methodology to test crosstalk defects in the buses of a DSP chip. Using a new high-level crosstalk simulation technique, we have validated the self-test methodology, including the self-test structures inserted in the DSP chip.