Signal Integrity: Fault Modeling and Testing in High-Speed SoCs

  • Authors:
  • Mehrdad Nourani;Amir Attarha

  • Affiliations:
  • Center for Integrated Circuits & Systems, The University of Texas at Dallas, Richardson, TX 75083-0688, USA. nourani@utdallas.edu;Center for Integrated Circuits & Systems, The University of Texas at Dallas, Richardson, TX 75083-0688, USA. attarha@utdallas.edu

  • Venue:
  • Journal of Electronic Testing: Theory and Applications
  • Year:
  • 2002

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Abstract

As we approach 100 nm technology the interconnect issues are becoming one of the main concerns in the testing of gigahertz system-on-chips. Voltage distortion (noise) and delay violations (skew) contribute to the signal integrity loss and ultimately functional error, performance degradation and reliability problems. In this paper, we first define a model for integrity faults on the high-speed interconnects. Then, we present a BIST-based test methodology that includes two special cells to detect and measure noise and skew occurring on the interconnects of the gigahertz system-on-chips. Using an inexpensive test architecture the integrity information accumulated by these special cells can be scanned out for final test and reliability analysis.