Spectral techniques for high-resolution thermal characterization with limited sensor data
Proceedings of the 46th Annual Design Automation Conference
On-line sensing for healthier FPGA systems
Proceedings of the 18th annual ACM/SIGDA international symposium on Field programmable gate arrays
A statistical framework for designing on-chip thermal sensing infrastructure in nano-scale systems
Proceedings of the 19th international symposium on Physical design
Thermal monitoring of real processors: techniques for sensor allocation and full characterization
Proceedings of the 47th Design Automation Conference
Proceedings of the 2010 Asia and South Pacific Design Automation Conference
Run-time adaptable on-chip thermal triggers
Proceedings of the 16th Asia and South Pacific Design Automation Conference
Full-chip runtime error-tolerant thermal estimation and prediction for practical thermal management
Proceedings of the International Conference on Computer-Aided Design
Recent thermal management techniques for microprocessors
ACM Computing Surveys (CSUR)
Proceedings of the 49th Annual Design Automation Conference
Integration, the VLSI Journal
A power-driven thermal sensor placement algorithm for dynamic thermal management
Proceedings of the Conference on Design, Automation and Test in Europe
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
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High-performance microprocessor families employ dynamic-thermal-management techniques to cope with the increasing thermal stress resulting from peaking power densities. These techniques operate on feedback generated from on-die thermal sensors. The allocation and the placement of thermal-sensing elements directly impact the effectiveness of the dynamic management mechanisms. In this paper, we propose systematic techniques for determining the optimal locations for thermal sensors to provide high-fidelity thermal monitoring of a complex microprocessor system. Our strategies can be divided into two main categories: uniform sensor allocation and nonuniform sensor allocation. In the uniform approach, the sensors are placed on a regular grid. The nonuniform allocation identifies an optimal physical location for each sensor such that the sensor's attraction toward steep thermal gradients is maximized, which can result in uneven concentrations of sensors on different locations of the chip. We also present a hybrid algorithm that shows the tradeoffs associated with number of sensors and expected accuracy. Our experimental results show that our uniform approach using interpolation can detect the chip temperature with a maximum error of 5.47degC and an average maximum error of 1.05degC . On the other hand, our nonuniform strategy is able to create a sensor distribution for a given microprocessor architecture, providing thermal measurements with a maximum error of 3.18degC and an average maximum error of 1.63degC across a wide set of applications.