ElectroMagnetic Analysis (EMA): Measures and Counter-Measures for Smart Cards
E-SMART '01 Proceedings of the International Conference on Research in Smart Cards: Smart Card Programming and Security
Electromagnetic Analysis: Concrete Results
CHES '01 Proceedings of the Third International Workshop on Cryptographic Hardware and Embedded Systems
CHES '02 Revised Papers from the 4th International Workshop on Cryptographic Hardware and Embedded Systems
Power Analysis Attacks: Revealing the Secrets of Smart Cards (Advances in Information Security)
Power Analysis Attacks: Revealing the Secrets of Smart Cards (Advances in Information Security)
Power and electromagnetic analysis: improved model, consequences and comparisons
Integration, the VLSI Journal - Special issue: Embedded cryptographic hardware
CHES '08 Proceeding sof the 10th international workshop on Cryptographic Hardware and Embedded Systems
ACM Transactions on Reconfigurable Technology and Systems (TRETS)
Enhancing correlation electromagnetic attack using planar near-field cartography
Proceedings of the Conference on Design, Automation and Test in Europe
CHES'05 Proceedings of the 7th international conference on Cryptographic hardware and embedded systems
Localized electromagnetic analysis of cryptographic implementations
CT-RSA'12 Proceedings of the 12th conference on Topics in Cryptology
COSADE'12 Proceedings of the Third international conference on Constructive Side-Channel Analysis and Secure Design
Hi-index | 0.00 |
The electromagnetic field as a side-channel of cryptographic devices has been linked to several advantages in past contributions. We provide a comprehensive study using high-resolution horizontal and vertical magnetic field probes at close distance to an integrated circuit die. We configured an FPGA device with two uncorrelated digital structures showing similar leakage behavior as symmetric cryptography implementations. We found that measurements from the frontside of the die using a horizontal probe lead to the highest signal-to-noise ratios. Further, high sampling rates are required and no trace compression should be applied. Contrary to previous contributions, we successfully demonstrate that the leakage of design parts is locally restricted and matches their placement. This proves the feasibility of localized side-channel analysis after a profiling phase, however, also means that other locations will lead to inferior results, which is an important limitation. Our analysis confirmed an advantage of measuring localized electromagnetic fields instead of current consumption due to the fact that less parasitic capacitances are involved.