The next resource war: computation vs. communication
Proceedings of the 2008 international workshop on System level interconnect prediction
Interlayer cooling potential in vertically integrated packages
Microsystem Technologies - Special Issue on MicroNanoReliability 2007
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Pinned to the walls: impact of packaging and application properties on the memory and power walls
Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design
Toward five-dimensional scaling: how density improves efficiency in future computers
IBM Journal of Research and Development
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Chip microscale liquid-cooling reduces thermal resistance and improves datacenter efficiency with higher coolant temperatures by eliminating chillers and allowing thermal energy re-use in cold climates. Liquid cooling enables an unprecedented density in future computers to a level similar to a human brain. This is mediated by a dense 3D architecture for interconnects, fluid cooling, and power delivery of energetic chemical compounds transported in the same fluid. Vertical integration improves memory proximity and electrochemical power delivery creating valuable space for communication. This strongly improves large system efficiency thereby allowing computers to grow beyond exa-scale.