Full-chip multiple TSV-to-TSV coupling extraction and optimization in 3D ICs

Authors:
Taigon Song;Chang Liu;Yarui Peng;Sung Kyu Lim
Affiliations:
Georgia Institute of Technology, Atlanta, GA;Broadcom Corporation, Irvine, CA;Georgia Institute of Technology, Atlanta, GA;Georgia Institute of Technology, Atlanta, GA
Venue:
Proceedings of the 50th Annual Design Automation Conference
Year:
2013

Citing 3
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Abstract

TSV-to-TSV coupling is a new parasitic element in 3D ICs and can become a significant source of signal integrity problem. Existing studies on its extraction, however, becomes highly inaccurate when handling more than two TSVs on full-chip scale. In this paper we investigate the multiple TSV-to-TSV coupling issue and propose an accurate model that can be efficiently used for full-chip extraction. Unlike the common belief that only the closest neighboring TSVs affect the victim, our study shows that non-neighboring aggressors also cause non-negligible impact. Based on this observation, we propose an effective method of reducing the overall coupling level in multiple TSV cases.